Ensuring data gets to where it’s supposed to go at exactly the right time is a growing challenge for design engineers and architects developing heterogeneous systems. There is more data moving around ...
Bread-and-Butter Case Verification In most test-based environments that use dynamic simulation, the aim is to start throwing ...
A new technical paper titled “Towards Fine-grained Partitioning of Low-level SRAM Caches for Emerging 3D-IC Designs” was ...
A Compact Behavioral Model for Volatile Memristors” was published by researchers at Technion – Israel Institute of Technology ...
A new technical paper titled “Breakthrough low-latency, high-energy-efficiency LLM inference performance using NorthPole” was published by researchers at IBM Research. At the IEEE High Performance ...
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. Key drivers are the regionalization of semiconductor fabs and the increasing ...
A new technical paper titled “Hardware Acceleration of Kolmogorov-Arnold Network (KAN) for Lightweight Edge Inference” was ...
A new technical paper titled “Bendable non-silicon RISC-V microprocessor” was published by researchers at Pragmatic Semiconductor, Qamcom, and Harvard University. From the abstract: “Here we present ...
A new technical paper titled “Using both faces of polar semiconductor wafers for functional devices” was published by ...
Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...
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